Moulding compositions

Details Moulding compositions Moulding compositions

C - Chemistry, Metallurgy

08

G

18/1172, 402/46,

C08G 14/06 (2006.01) C08G 14/10 (2006.01) C08L 61/34 (2006.01)

Patent

CA 1233292

ABSTRACT "MOULDING COMPOSITION" A series of melamine-phenol-formaldehyde resoles for pressure-free to low pressure, low/ medium temperature conversion into moulded products. The molar ratio of melamine:phenol is in the range 1:4.7 to 1:0.29; for each mole of melamine there are 1.5 to 3 moles of formaldehyde; and for each mole of phenol there are 1.2 to 2 moles of formaldehyde. The resin compositions may contain fillers/reinforcing fibres, glycols and water curing is at or near neutral pH and may be accelerated by the use of boric oxide or acid and also by microwave heating. Moulded products have good heat- and fire-resistance, and good smoke emission properties, and are non-toxic.

460606

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