Moulding compositions including an unsaturated polyester

Details Moulding compositions including an unsaturated polyester Moulding compositions including an unsaturated polyester

C - Chemistry, Metallurgy

08

K

400/1705, 400/76

C08K 5/14 (2006.01) C08G 63/54 (2006.01) C08G 63/553 (2006.01) C08G 63/682 (2006.01) C08K 3/00 (2006.01) C08L 67/06 (2006.01)

Patent

CA 1074039

ABSTRACT OF THE DISCLOSURE Holding composition comprising from 10 to 50 wt.% of the polycondenation product of an alkylene glycol or a mixture of the l?ttor with up to 20 wt.% of 2,2'-blis(4- -hydroxycyclohexyl) propane or a halogenated derivative thereof, with an ethylenically unsaturated bicarboxylic acid and a saturated bicarboxylic acid, having a melting point of at least 60°C, an acid value of less than 50 and a Gardner viscosity from Y to Z3, from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70°C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields.

263675

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