Moulding compositions including an unsaturated polyester

C - Chemistry – Metallurgy – 08 – K

Patent

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400/1705, 341/68

C08K 5/14 (2006.01) C08G 63/553 (2006.01) C08G 63/682 (2006.01) C08K 3/00 (2006.01) C08L 67/06 (2006.01)

Patent

CA 1074040

ABSTRACT OF THE DISCLOSURE Holding composition comprising from 10 to 50 wt.% of the polycondenation product of 2,2'-bis(4-hydroxycyclohoxyl) propane or a halogenated derivative thereof, and maleic or fumaric acid, having a molting point above 70°C, an acid value of less than 50 and Gardner viscusity from Y to Z3, from 0.2 to 2wt.% of an organic peroxide which decomposes at a temperature above 70°C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields.

263723

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