Moulding compositions including unsaturated polyesters and...

Details Moulding compositions including unsaturated polyesters and... Moulding compositions including unsaturated polyesters and...

C - Chemistry, Metallurgy

08

L

400/1705, 400/57

C08L 67/06 (2006.01) C08F 299/04 (2006.01) C08G 63/553 (2006.01) C08G 63/682 (2006.01) C08K 7/00 (2006.01)

Patent

CA 1074038

ABSTRACT OF THE DISCLOSURE Molding composition comprising an inert filler, from 0.2 to 2 ?.% of an organic peroxide with a decompostion tempora- ture abouve 70°C, from 0.5 to 10 ?.% of an amide of an unsaturated aliphatic carboxylic acid, and from 10 to 50 ?.% of unsaturated polyester A and/or unsaturated polyester B, wherein said polyester A is the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl) propane or a halogented derivative thereof with an unsaturated bicarboxyylic acid, and said polyester B is the polycondensation product of an alklene glycol with an unsaturated bicarboxyylic acid and a saturated bicarboxylic acid. The resulting molded articles are particularly useful in the electrical and electronic fields.

263661

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