Moulding process

B - Operations – Transporting – 29 – C

Patent

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18/1023

B29C 59/02 (2006.01)

Patent

CA 1062865

ABSTRACT OF THE DISCLOSURE The Specification describes a process for the surface moulding of a sheet of thermoplastic synthetic resin which comprises compressing a laminate structure comprising the said sheet of thermoplastic synthetic resin at above the softening temperature of the said resin in contact with a perforated non-resilient sheet, the opposite side of which is in contact with a sheet of resilient material, the pressure applied to the said structure being such that thermoplastic synthetic resin and resilient material are forced into the perforations of the said non-resilient sheet and come into mutual contact therein, the resulting surface moulded sheet of thermoplastic resin being cooled to below the softening temperature of the resin and subsequently separated from the said non-resilient sheet.

266440

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