Moulding process

Details Moulding process Moulding process

B - Operations, Transporting

29

C

B29C 35/02 (2006.01) B29C 39/00 (2006.01) B29C 39/40 (2006.01) C08J 3/20 (2006.01) C08L 63/00 (2006.01) B29C 37/00 (2006.01)

Patent

CA 2109974

Moulding Process Abstract of the Disclosure The present invention provides a process for making a cured plastics moulding byintroducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition, wherein the curable resin is an epoxy resin formulation comprising an epoxy resin containing more than one epoxide group per molecule on average, an acid anhydride hardener, an accelerator and a filler, the epoxy resin, hardener and accelerator being chosen so that the formulation is stable at 25°C for at least 14 days.

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