Mounting a component to a substrate

Details Mounting a component to a substrate Mounting a component to a substrate

G - Physics

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G02B 6/38 (2006.01) G01J 3/26 (2006.01) G02B 26/02 (2006.01) G02B 26/04 (2006.01) G02B 26/08 (2006.01) G02F 1/21 (2006.01) H01S 3/10 (2006.01)

Patent

CA 1278910

MOUNTING A COMPONENT TO A SUBSTRATE ABSTRACT A method of mounting an optical component such as a laser chip (4) on a substrate (1) is described. The method comprises mounting the chip (4) on a bridge (9); and positioning the bridge (9) on the substrate (1). Locator means in the form of depending legs (10) are provided on the bridge (9) so that the bridge is located in the vertical direction relatively to the substrate (1) and hence the laser chip (4) is also located. Finally, the chip (4) is secured to the substrate (1) by, for example, soldering.

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