Mounting arrangement for securing an integrated circuit...

Details Mounting arrangement for securing an integrated circuit... Mounting arrangement for securing an integrated circuit...

H - Electricity

01

L

H01L 23/40 (2006.01)

Patent

CA 2308587

A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvilinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other just so as to cause moderate compression of the opposing ends of the spring toward each other as the package is inserted against the heat sink surface. The opposing surfaces of the two walls are provided with a plurality of notches formed substantially parallel to the heat sink surface in a "ratchet-type" relief pattern, such that the opposing ends of the retaining- spring are held into place by respective notches, once the IC package is secured against the heat sink.

L'invention concerne la surface supérieure d'un couvercle protecteur de boîtier de circuit intégré, comportant une protrusion centrale, une cheville cylindrique par exemple, disposée sur ledit couvercle. Pour former un ressort de retenue, on tord une bande métallique résiliente (par exemple un métal) de façon à lui donner une forme de ruban dont les extrémités opposées partent d'une surface de base curviligne. La surface de base dudit ressort présente une ouverture configurée de façon à s'apparier avec la protrusion centrale du couvercle, tandis que ses extrémités opposées s'éloignent dudit couvercle en formant des angles sensiblement égaux mais inversés. Pour monter le boîtier sur un dissipateur thermique, on fixe par compression la surface de base du ressort de retenue sur le couvercle du boîtier, tout en insérant ce dernier entre deux parois sensiblement parallèles qui partent de la surface du dissipateur thermique et qui sont écartées l'une de l'autre de façon à comprimer modérément les extrémités opposées du ressort et à les rapprocher quand on presse le boîtier contre la surface du dissipateur. Les surfaces opposées des deux parois présentent une pluralité d'encoches sensiblement parallèles à la surface du dissipateur, qui forment un relief de type rochet et qui maintiennent en place les extrémités opposées du ressort de retenue une fois que le boîtier est fixé sur le dissipateur.

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