Mounting assembly for power semiconductors

Details Mounting assembly for power semiconductors Mounting assembly for power semiconductors

H - Electricity

05

K

H05K 7/20 (2006.01)

Patent

CA 2152359

A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201, 203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).

Affiliated with

Also associated with

Rating

Mounting assembly for power semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mounting assembly for power semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting assembly for power semiconductors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1811585