H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/08 (2006.01) H01L 21/60 (2006.01) H01L 23/12 (2006.01) H01L 23/498 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2230903
A mounting assembly of an integrated circuit device includes an integrated circuit device having pads on its lower side, through holes formed in a mounting substrate at positions opposed to the pads of the integrated circuit device, and solders for connecting the pads of the integrated circuit device with the through holes. An electrode is provided on the inside wall of each through hole, and the mounting substrate includes therein wirings connected to the electrodes. The solder is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate.
Ensemble de montage de dispositif à circuit intégré muni d'un dispositif à circuit intégré équipé des éléments suivants : des plots sur sa face inférieure; des trous de passage formés sur un substrat de montage à des emplacements situés à l'opposé des plots du dispositif à circuit intégré; et des soudures pour relier les plots de ce dispositif à circuit intégré aux trous de passage. Une électrode est installée sur la paroi interne de chaque trou de passage, le substrat de montage offrant à ce niveau des connexions avec les électrodes. La soudure remplit les trous de passage de manière à ce qu'on puisse apercevoir cette soudure de la face inférieure du substrat.
Corporation Nec
Smart & Biggar
LandOfFree
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