Mounting beam for preparing wafers

Details Mounting beam for preparing wafers Mounting beam for preparing wafers

B - Operations, Transporting

24

D

57/12, 164/18

B24D 3/28 (2006.01) B24B 53/047 (2006.01) B28D 5/00 (2006.01)

Patent

CA 1263812

Abstract of the Disclosure A self-dressing mounting beam for slicing wafers from ingots of various materials, especially semiconductors, is described. The mounting beam is a composite material com- prising an organic polymer, particles of abrasive and hollow microspheres. The ingot is mounted on the beam and sliced using an inside diameter saw. The saw penetrates the mount- ing beam as well as the ingot, so that the self-dressing feature is realized with each pass of the blade. 12

523430

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