Mounting of an integrated circuit on a support

H - Electricity – 01 – L

Patent

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356/193

H01L 23/48 (2006.01) G06K 19/077 (2006.01) H01L 21/60 (2006.01) H01L 23/485 (2006.01) H01L 23/498 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1264872

PRECIS DE LA DIVULGATION Un dispositif conforme à l'invention se présente sous la forme d'une pastille destinée à une carte du type carte de crédit. Pour souder les plots du circuit intégré à la couche métallique dans les trous du support, on donne aux plots une hauteur approximativement égale à l'épaisseur du support.

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