Mounting of dual-in-line electronic packages

Details Mounting of dual-in-line electronic packages Mounting of dual-in-line electronic packages

H - Electricity

05

K

347/35

H05K 3/30 (2006.01) H05K 7/10 (2006.01) H05K 13/02 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1063218

A B S T R A C T A method for mounting socket contacts to the leads of electronic component packages having a dual-in-line configuration, and for one-step mounting of the pre-socketed packages to dual-in- line array of holes in a panel board, Dual-in-line packages (DIP) are fed to a processor where a plurality of socket contacts are separated into two parallel spaced rows and the leads of the DIP are inserted into the sockets. The thus pre-socketed DIP's are repackaged for further handling, to ultimately be assembled to a panel board wherein dual-in-line arrays of holes have been drilled. The ends of the socket contacts projecting from the back side of the board are normally wave soldered for permanent elec- trical connection, while the IC remains in position secured to the board by means of the socket contacts,

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