H - Electricity – 03 – H
Patent
H - Electricity
03
H
26/128, 333/14,
H03H 3/08 (2006.01) H03H 9/05 (2006.01)
Patent
CA 1281810
ABSTRACT OF THE DISCLOSURE A SAW device is formed by applying metallised areas to a surface of a SAW substrate and attaching conductive leads to the metallised areas. The substrate is inverted and located on a hybrid circuit so that the leads contact and are supported on conductive areas of the circuit. This mounting arrangement minimises the stresses which occur in the substrate in its operational life. A novel diamond- shape for the device is also disclosed.
474637
Macdonald Brian M.
Rogerson Stephen P.
British Telecommunications Public Limited Company
G. Ronald Bell & Associates
Macdonald Brian M.
Rogerson Stephen P.
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