Mounting of semiconductor chips on a molded plastic substrate

Details Mounting of semiconductor chips on a molded plastic substrate Mounting of semiconductor chips on a molded plastic substrate

H - Electricity

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H01L 23/13 (2006.01) H01L 21/60 (2006.01) H01L 27/02 (2006.01) H05K 3/34 (2006.01) H05K 1/00 (2006.01) H05K 1/11 (2006.01)

Patent

CA 1257711

MOUNTING OF SEMICONDUCTOR CHIPS ON A MOLDED PLASTIC SUBSTRATE Abstract of the Disclosure A semiconductor chip mounting is provided by molding a substrate of heat resistant synthetic resin, forming contact pads, which may be protrusions or recesses, on a surface of the substrate as it is molded. A circuit pattern extends to the contact pads which have a conductive surface. The chip is directly mounted on the substrate by soldering contact areas on the chip to the contact pads on the substrate, thus avoiding wire bonding. - i -

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