H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/12 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01) H05K 3/36 (2006.01)
Patent
CA 2278006
The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device (4), such as CSP/BGA, to be securely fixed to a circuit board (5) by short-time heat curing (10), which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices.
La présente invention se rapporte à une structure de montage pour dispositifs semi-conducteurs qui permet la fixation fiable d'un dispositif semi-conducteur, tel qu'un dispositif CSP/BGA, à une plaquette de circuits, au moyen d'un traitement thermique de courte durée. Cette structure offre d'excellentes propriétés de résistance aux chocs thermiques (ou de résistance aux variations cycliques de température), et permet de retirer facilement le dispositif semi-conducteur de la plaquette de circuits en cas de défaillance. Cette invention se rapporte également à un procédé de montage pour dispositifs semi-conducteurs.
Iida Kazutoshi
Meguro Takeshi
Watanabe Masaki
Wigham Jon
Henkel Loctite Corporation
Kirby Eades Gale Baker
Loctite Corporation
Matsushita Electric Industrial Co. Ltd.
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