H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H01H 50/14 (2006.01) H01H 50/04 (2006.01) H01H 50/12 (2006.01) H05K 1/02 (2006.01) H05K 3/30 (2006.01)
Patent
CA 2218460
In a mounting structure for a relay 5 arranged on a printed circuit board 3, a resin block 20 having bus bars 21 and 22 as an insert is fixed on the printed circuit board 3, and one ends 21a and 22a of bus bars 21 and 22 held by the resin block 20 are joined together with terminals 6 and 7 of the relay 5 by welding, respectively, while the other end 22b of at least one, that is, the bus bar 22 of bus bars 21 and 22 being soldered to an printed wiring pattern formed on the printed circuit board 3. Therefore, a heat (temperature) of the terminal of the relay 5 can be absorbed through the bus bars and the resin block.
Cette invention concerne une structure de montage d'un relais 5 sur une carte à circuits imprimés 3, structure formée d'un bloc de résine 20 à inserts faisant office de barres omnibus 21 et 22. Ledit bloc de résine est fixé sur la carte à circuits imprimés 3 et les extrémités 21a et 22a des barres omnibus 21 et 22 sont soudées aux bornes 6 et 7 respectivement du relais 5 tandis que l'autre extrémité 22b d'au moins une des barres omnibus, soit la barre 22, est connectée par brasage à un secteur du circuit imprimé sur ladite carte 3. Ce mode de montage permet de dissiper la chaleur des bornes du relais 5 via les barres omnibus et le bloc de résine.
Kondo Youichi
Suzuki Masataka
Watanabe Yasuyuki
Gowling Lafleur Henderson Llp
Yazaki Corporation
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