H - Electricity – 05 – K
Patent
H - Electricity
05
K
26/127
H05K 3/00 (2006.01) H05K 3/34 (2006.01) H05K 7/14 (2006.01) H05K 9/00 (2006.01)
Patent
CA 1135036
MOUNTING STRUCTURE FOR PRINTED CIRCUIT BOARD Abstract In order to assist the mounting of a printed circuit board to a metallic frame and the soldering of a conductive pattern of the former to the latter, a wire rod of high solderability is bent to conform substantially with the outline of the frame and is disposed at the juncture between the frame and the marginal edge of the circuit board. The circuit board can thus be tempor- arily fixed to the frame by the resilience of the wire rod and then subjected to dip soldering. -1-
346993
Shinbo Shoji
Tateishi Masaaki
Alps Electric Co. Ltd.
Macrae & Co.
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