Mounting structure of flat-lead package-type electronic...

H - Electricity – 05 – K

Patent

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H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 1/02 (2006.01)

Patent

CA 1233910

MOUNTING STRUCTURE OF FLAT-LEAD PACKAGE-TYPE ELECTRONIC COMPONENT ABSTRACT OF THE DISCLOSURE A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.

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