H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/8
H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 1/02 (2006.01)
Patent
CA 1233910
MOUNTING STRUCTURE OF FLAT-LEAD PACKAGE-TYPE ELECTRONIC COMPONENT ABSTRACT OF THE DISCLOSURE A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.
487257
Kawamura Yasuo
Okada Nobuhide
Yamamoto Tsuyoshi
Fujitsu Limited
Mcfadden Fincham
LandOfFree
Mounting structure of flat-lead package-type electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mounting structure of flat-lead package-type electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting structure of flat-lead package-type electronic... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1330656