Multi-chip electronic package having laminate carrier and...

Details Multi-chip electronic package having laminate carrier and... Multi-chip electronic package having laminate carrier and...

H - Electricity

01

L

H01L 23/14 (2006.01) B32B 15/01 (2006.01) B65D 85/90 (2006.01) H01L 23/29 (2006.01) H01L 23/34 (2006.01) H01L 23/373 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01) H01L 25/18 (2006.01) H05K 1/02 (2006.01) H05K 3/46 (2006.01) H01L 23/31 (2006.01) H05K 1/11 (2006.01)

Patent

CA 2454971

A multi-chip electronic package which utilizes an organic, laminate chip carrier and a plurality of semiconductor chips positioned on an upper surface of the carrier. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities.

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