Multi-component microcircuit packages

Details Multi-component microcircuit packages Multi-component microcircuit packages

H - Electricity

05

K

347/35

H05K 5/06 (2006.01) H01L 21/50 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1128185

MULTI-COMPONENT MICROCIRCUIT PACKAGES ABSTRACT A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion having a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.

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