Multi-fiber alignment package for optoelectronic components

Details Multi-fiber alignment package for optoelectronic components Multi-fiber alignment package for optoelectronic components

G - Physics

02

B

345/62

G02B 6/42 (2006.01)

Patent

CA 2022532

MULTI-FIBER ALIGNMENT PACKAGE FOR OPTOELECTRONIC COMPONENTS ABSTRACT A localized cooling method allows the sequential alignment and soldering of one optical fiber at a time to a semiconductor package, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber opto- electronic packages demanding stability and high precision. A package design for optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The localized cooling method and the novel package utilizing this method internally make it possible to eliminate the tilted angle optical fiber alignment problem by mounting tilted facet optical amplifier components at a predetermined offset angle.

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