Multi-functional structural circuits

H - Electricity – 05 – K

Patent

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H05K 3/00 (2006.01) H05K 3/22 (2006.01) H05K 3/30 (2006.01)

Patent

CA 2586855

A method and apparatus relating to a multi~functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

La présente invention concerne un procédé et un dispositif associés à un circuit structurel polyvalent, appelé circuit structurel. Le procédé décrit dans cette invention peut consister à thermoformer un circuit polymère à cristaux liquides (PCL) avec un élément structurel (215). Au moins un composant du circuit peut être relié à la surface du circuit OCL (220).

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