H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H05K 3/22 (2006.01) H05K 3/30 (2006.01)
Patent
CA 2586855
A method and apparatus relating to a multi~functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
La présente invention concerne un procédé et un dispositif associés à un circuit structurel polyvalent, appelé circuit structurel. Le procédé décrit dans cette invention peut consister à thermoformer un circuit polymère à cristaux liquides (PCL) avec un élément structurel (215). Au moins un composant du circuit peut être relié à la surface du circuit OCL (220).
Jaynes Paul B.
Kerby Travis L.
Newton Charles M.
Smith C. W. Sinjin
Goudreau Gage Dubuc
Harris Corporation
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