H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/5
H05K 1/03 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/10 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2008284
A MULTI-LAYER CERAMIC SUBSTRATE ASSEMBLY AND A PROCESS FOR MANUFACTURING SAME ABSTRACT OF THE DISCLOSURE A multi-layer ceramic substrate assembly comprising a multi-layer ceramic substrate including a via- conductor and an interconnecting line and having a surface, a first soldering pad on the surface of the substrate and connected to the via-conductor, a second soldering pad on the surface of the substrate adjacent to the first soldering pad, a connecting pattern on the surface of the substrate for connecting the first and second soldering pads, the connecting pattern being made of an electric conductor wettable with a solder, and a solder dam formed on the connecting pattern between the first and second soldering pads, the solder dam being made of a metal or a metal alloy or compound not wettable with a solder. The electric conductivity of the connecting pattern is carried by a metal having a good electric conductivity and the solder dam is made of a metal or a metal alloy or compound not wettable with a solder, whereby the solder dam stops a flow of a solder through the dam or under the dam. A simple and reliable process for forming such a solder dam is also provided.
Fujitsu Limited
Mcfadden Fincham
LandOfFree
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