H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) H01L 23/373 (2006.01) H05K 3/46 (2006.01) H05K 1/05 (2006.01) H05K 1/09 (2006.01) H05K 1/18 (2006.01)
Patent
CA 2072817
ABSTRACT OF THE DISCLOSURE A multi-layer heat dissipating circuit board provides a thermally conductive base plate. An electrically insulating and thermally conductive base insulating layer is disposed over the base plate upon one face thereof. A plurality of alternating layers of electrically conductive leads and selectively disposed insulation are deposited over the base plate and its base insulating layer with portions of the insulation between alternating layers of electrically conductive leads being exposed so that leads of upper layers may be connected to leads of lower layers. The base plate may be constructed of aluminum while at least one of either the insulating or electrically conductive layers may be applied by means of silk screening of a liquid compound that is subsequently hardened.
Desorgo Miksa
Lionetta William G. Jr.
Mcgovern James F.
Chomerics Inc.
Smart & Biggar
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