Multi-layer circuit board

Details Multi-layer circuit board Multi-layer circuit board

B - Operations, Transporting

32

B

356/1, 154/136,

B32B 17/04 (2006.01) B32B 17/10 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2015681

A multi-layer circuit board for fine conductors is disclosed, which consists of at least one multi-layer laminate with the following layer structure: a) inner layer, b) a resin impregnated glass textile (prepreg) layer applied to the inner layer, c) a polyvinyl fluoride foil applied to the prepreg layer, d) an intermediate sheet that is applied to the foil.

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