H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/16
H05K 1/02 (2006.01) H05K 1/05 (2006.01) H05K 1/16 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2014892
Attorney's Docket No. 8069 CAN INVENTORS: MARCO MARTINELLI, WALTER SCHMIDT and HANS-J?RGEN REUTER INVENTION: MULTI-LAYER CIRCUIT BOARD ABSTRACT OF THE DISCLOSURE In a multilayer printed wiring board having at least two circuitry planes or surfaces spaced apart by an electrically insulating intermediate layer, mechanically reinforcing means are laminated into the printed wiring board, such mechanically reinforcing means stiffening the printed wiring board and forming at the same time in predetermined sections electrical conductor lines which are associated to the electrical layout of the printed wiring board. In this manner, the electrical as well as the mechanical characteristics and properties of the insert material are utilized at the same time. This insert material is preferably electrically conductive carbon in the form of carbon fibers. A so-called prepreg consisting of carbon fibers, i.e. a graphite weave sheet impregnated with resin, can be laminated in the form of a layout into the multilayer printed wiring board and can partially or entirely take over - 1 - the electrical functions and at the same time act as a reinforcement. WWK:GR:ke-nc3 - 2 -
Martinelli Marco
Reuter Hans-Jurgen
Schmidt Walter
Dyconex Ag
Gowling Lafleur Henderson Llp
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