Multi-layer circuitry

Details Multi-layer circuitry Multi-layer circuitry

H - Electricity

05

K

356/10

H05K 1/14 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 3/36 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1197324

ABSTRACT Multi-layer circuitry incorporating electronic elements is disclosed. The circuitry comprises a plurality of layers including a metal or alloy substrate formed with a recess on one surface. An electronic element is positioned within the recess and a second electronic element is positioned on the surface. Also, a first dielectric material layer is disposed on the surface. Further, a first layered conductive circuit pattern overlies the first dielectric material layer so as to provide circuitry over a substantial portion of the substrate. The first circuit pattern is electrically connected to the first electronic element. The first circuit pattern also has a cavity therein for receiving the second electronic element. A second layered conductive pattern overlies at least a portion of the first layered conductive circuit pattern and the second electronic element and is electrically connected to the second electronic element. A second dielectric material layer is disposed between the first and second layered conductive circuit patterns so that these circuit patterns are bonded to and isolated from each other.

426744

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