Multi-layer dielectric structure

Details Multi-layer dielectric structure Multi-layer dielectric structure

H - Electricity

05

K

356/10, 347/34

H05K 1/14 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1126874

Abstract The coating of a conductor pattern on dielectric green sheets to a common edge thereof with stacking or superimpositioning together of a plurality of sheets to enclose the conductor pattern followed by sinter- ing; with the eage side of the fired body having the exposed end terminations becoming the actual face of the body on which a semiconductor device is mounted in electrical circuit connection to respective ones of the common end terminations of the conductor runs. The opposite or distal ends of the conductor runs may be fanned out to the opposite edge of side of the fired body in increased spaced relationship to each other.

326900

Affiliated with

Also associated with

Rating

Multi-layer dielectric structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer dielectric structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer dielectric structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-247676