Multi layer, heat-curable adhesive film

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 7/02 (2006.01) B32B 27/38 (2006.01) C08G 59/22 (2006.01) C08G 59/38 (2006.01) C09J 7/00 (2006.01)

Patent

CA 1336371

Multi-layer, heat-curable adhesive film having a tacky external curable layer A and a dry external curable layer B, containing various adducts which contain epoxide groups and are formed from an aromatic diglycidyl or polyglycidyl ether together with a carboxyl-terminated butadiene/acrylonitrile rubber and adducts of this type with a car boxyl-terminated polyester, and also aromatic diglycidyl or polygly- cidyl ethers, varying amounts of fillers, dicyandiamide as a curing agent, a curing accelerator and, if appropriate, a carrier material between the layers A and B, is suitable for bonding various substrates and is preferably employed for bonding metal structural components without prior cleaning of these components.

562066

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