H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H05K 3/00 (2006.01) H05K 3/06 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2360325
A method of forming a multi-layer laminate from a plurality of individual laminates comprised of copper clad on a polyimide.
L'invention concerne un procédé d'obtention d'une feuille multicouches à partir d'une pluralité de feuilles individuelles formées de plaqué cuivre sur un polyimide.
Centanni Michael A.
Kusner Mark
Potkonicky Joseph A. Jr.
Ga-Tek Inc. (dba Gould Electronics Inc.)
Gould Electronics Inc.
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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