Multi-layer lead frames for integrated circuit packages

Details Multi-layer lead frames for integrated circuit packages Multi-layer lead frames for integrated circuit packages

H - Electricity

01

L

H01L 23/495 (2006.01) H01L 21/48 (2006.01)

Patent

CA 2065295

2065295 9106978 PCTABS00005 A composite lead frame (70) is provided. The lead frame (70) comprises a rigid metal portion (30) electrically interconnected (72) to a flexible multi-layer portion (40). The composite lead frame (70) provides for higher lead densities with better electrical and mechanical properties than achieved with either rigid metal lead frames or flexible leads.

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