Multi-layer panel board with single-in-line package for high...

Details Multi-layer panel board with single-in-line package for high... Multi-layer panel board with single-in-line package for high...

H - Electricity

05

K

347/35

H05K 7/02 (2006.01) H01R 12/16 (2006.01) H05K 3/22 (2006.01) H05K 1/00 (2006.01) H05K 1/18 (2006.01)

Patent

CA 1047637

A B S T R A C T A multi-layer panel employing a resistor-terminator module in the form of a single-in-line package located adjacent conventional dual-in-line packages, with interconnections to be made by means of wire wrapping. The resistors in the single-in- line package have one common lead electrically connected to a conductive layer in the panel. Conductive layer surface areas are maximized for improved signal transmission characteristics.

245400

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