Multi-layer superconducting circuit substrate and process...

Details Multi-layer superconducting circuit substrate and process... Multi-layer superconducting circuit substrate and process...

H - Electricity

01

L

352/49

H01L 39/04 (2006.01) B32B 18/00 (2006.01) C04B 35/45 (2006.01) C04B 35/634 (2006.01) C04B 35/636 (2006.01) G11C 11/44 (2006.01) H01L 21/48 (2006.01) H01L 21/768 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H01L 39/24 (2006.01)

Patent

CA 1329952

MULTI-LAYER SUPERCONDUCTING CIRCUIT SUBSTRATE AND PROCESS FOR MANUFACTURING SAM ABSTRACT OF THE DISCLOSURE A multi layer superconducting circuit substrate, comprising insulating layers and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material is preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

564766

Affiliated with

Also associated with

Rating

Multi-layer superconducting circuit substrate and process... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer superconducting circuit substrate and process..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer superconducting circuit substrate and process... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1223322