H - Electricity – 01 – P
Patent
H - Electricity
01
P
H01P 3/18 (2006.01) H01P 1/203 (2006.01) H01P 3/06 (2006.01) H01P 3/08 (2006.01) H01P 7/08 (2006.01)
Patent
CA 2206615
A multi-layer thin-film electrode comprises thin conductor films and thin dielectric films each being alternately laminated on a dielectric substrate, in which an electro-magnetic field generated in the dielectric substrate and that generated in each of the thin dielectric films have substantially the same phase at a predetermined frequency. According to the multi-layer thin-film electrode of the present invention, adhesive conductor films that more readily form metallic oxide as compared with the thin conductor films are provided between the dielectric substrate and the thin conductor films adjacent thereto and between each of the thin conductor films and the thin dielectric film adjacent thereto, respectively, and an increase in the surface reactance of the thin conductor films caused by the adhesive conductor film formation is canceled by correcting the thickness of each of the thin dielectric films based on the dielectric constant of the thin dielectric film and the dielectric substrate and the thickness of at least one of the adhesive conductor film.
L'invention est une électrode constituée de couches conductrices minces et de couches diélectriques minces déposées en alternance sur un substrat diélectrique, dans laquelle un champ électromagnétique engendré dans le substrat diélectrique et les champs engendrés dans chacune des couches diélectriques ont essentiellement la même phase à une fréquence prédéterminée. Dans la présente invention, des couches conductrices adhésives produisant un oxyde métallique plus rapidement que les couches minces conductrices sont placées entre le substrat diélectrique et les couches minces conductrices adjacentes et entre chacune des couches minces conductrices et la couche mince diélectrique adjacente respectivement, et l'augmentation de la réactance surfacique des couches minces conductrices causée par la formation de couches conductrices adhésives est annulée en corrigeant l'épaisseur de chacune des couches minces diélectriques par l'intermédiaire de la constante diélectrique de la couche mince diélectrique et du substrat diélectrique, et en corrigeant l'épaisseur d'au moins une des couches conductrices adhésives.
Hidaka Seiji
Ise Tomoyuki
Ishikawa Yohei
Matsui Norifumi
Mccarthy Tetrault Llp
Murata Manufacturing Co. Ltd.
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