Multi-layer vacuum evaporation deposition method

Details Multi-layer vacuum evaporation deposition method Multi-layer vacuum evaporation deposition method

H - Electricity

05

K

117/64

H05K 3/10 (2006.01) C23C 14/04 (2006.01) C23C 14/56 (2006.01) H05K 3/14 (2006.01)

Patent

CA 1105333

MULTI-LAYER VACUUM EVAPORATION DEPOSITION METHOD Abstract of the Disclosure A multi-layer vacuum evaporation deposition method fixes at least one substrate together with a mask to a rotary substrate holder. A first film is formed on the substrate by using a first evaporation source confronting the substrate, while the holder is rotated about a central axis. A second film is deposited on the first film by using a second evaporation source. One of the sources is located inside a cone defined by a figure of revolution about the central axis of a line from the other source to an end of the substrate most remote therefrom. The other source is located outside a cone defined by a figure of revolution about the axis of a line from the one source to an end of the substrate nearest thereto. The result is reduction in the number of steps required in the process, and the avoidance of the need for wet treatments, while achieving the objective of making the pattern size of one film smaller than that of the other.

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