Multi-layer wiring board

Details Multi-layer wiring board Multi-layer wiring board

H - Electricity

05

K

H05K 1/03 (2006.01) H01L 23/15 (2006.01)

Patent

CA 2051606

A multi-layer wiring board comprising a laminate of glass ceramic layers and conductor patterns, the glass ceramic layers being made of a glass ceramic comprising glass and ceramic particles dispersed therein, the glass ceramic layers further comprising hollow or porous silica glass spheres dispersed in the glass ceramic, the hollow or porous silica glass spheres being covered with a ceramic coating layer containing aluminum as a constitutional element. This enables a crystallization of the silica spheres to be prevented, and thus a rapid increase of the thermal expansion coefficient and a formation of pores in the surface of the spheres are also prevented.

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