Multi-layer wiring substrate

Details Multi-layer wiring substrate Multi-layer wiring substrate

H - Electricity

05

K

H05K 3/46 (2006.01) B32B 18/00 (2006.01) H01L 21/48 (2006.01) H01L 21/68 (2006.01) H05K 1/02 (2006.01) H05K 3/40 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2139267

A method of fabricating a ceramic multi-layer wiring substrate, in which deformation of ceramic green sheets is prevented so that probability of connection failure of through-holes is reduced, includes forming a ceramic green sheet on a carrier film, and then forming through-holes through the ceramic green sheet and the carrier film. The carrier film is used as a mask when the through-holes are filled with electrically-conductive paste. The green sheet is attached onto a thick plate. Green sheets attached onto respective thick plates are sequentially adhered and laminated temporarily. The laminated green sheets form a ceramic green sheet lamination block which is sintered, resulting in a ceramic multi-layer wiring substrate.

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