Multi-layered electronic parts

G - Physics – 01 – R

Patent

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G01R 31/311 (2006.01) G01N 21/956 (2006.01)

Patent

CA 2373116

A novel optical inspection technique for multi-layer wafers and the like in which conductor patterns of a top layer only are to be inspected, such layer being upon an intermediate transparent or translucent insulation layer in turn upon a base layer(s) thereunder, wherein the intermediate layer only is fluoresced, displaying the top layer conductors as dark in the field of fluorescent light, and causing reflections from layers below the intermediate layer effectively to disappear to obviate confusion with the top layer conductors to be inspected.

La présente invention concerne un nouveau procédé d'inspection optique de tranches multicouches et analogues dont seuls les tracés conducteurs d'une couche supérieure doivent être inspectés, cette couche supérieure se trouvant sur une couche intermédiaire isolante transparente ou translucide elle-même déposée sur au moins une couche de base inférieure. Seule la couche intermédiaire émet une fluorescence qui fait apparaître les conducteurs de la couche supérieure en foncé dans le champ de la lumière fluorescente, et disparaître efficacement les réflexions provenant des couches se trouvant sous la couche intermédiaire, de façon que l'on évite la confusion avec les conducteurs de la couche supérieure à inspecter.

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