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H - Electricity
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Patent
CA 1123116
Multilayered Glass-Ceramic Substrate For Mounting Of Semiconductor Device Abstract A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multilayered glass-ceramic superstructure with a multilayered distribution of-conductors on a preformed multi- layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of con- ductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to exposed conductor patterns at the top surface of the resultant glass-ceramic package. FI9-78-039
343375
Narken Bernt
Tummala Rao R.
International Business Machines Corporation
Na
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