Multi-lead component manipulator

Details Multi-lead component manipulator Multi-lead component manipulator

H - Electricity

01

L

356/194, 356/22

H01L 21/68 (2006.01) B23P 19/00 (2006.01) B25J 13/08 (2006.01) B25J 15/02 (2006.01)

Patent

CA 1201823

17 ABSTRACT OF THE INVENTION A multi-lead component manipulator for the assembly of circuit boards has optical and tactile feedback systems and includes at least two and preferably three symmetric assemblies radially disposed about a component gripper assembly. Each symmetric assembly has a movable lead guide means for engaging a component lead and align- ing the same for circuit board insertion. The guide means are adapted for independent arcuate and radial motion reflective of the optical feedback system and the gripper assembly is capable of axial movement for the acquisition and insertion of components. The tactile feedback system controls component insertion. The manipulator in an alternative embodiment has fixed guide means disposed above the movable guide means. The fixed guide means orient the component leads for acquisition by the movable guide means.

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