Multi-point solder paste application

Details Multi-point solder paste application Multi-point solder paste application

H - Electricity

05

K

356/6

H05K 3/00 (2006.01) B23K 3/06 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1257401

MULTI-POINT SOLDER PASTE APPLICATION Abstract of the Disclosure Solder paste is automatically applied to a circuit board, in a predetermined pattern in predetermined amounts, by filling holes in a plate with solder paste having prescribed physical characteristics. The plate is filled from the top and then pivotted over, the paste being ejected by pins in the holes onto a circuit board. The holes have defined dimensional characteristics. The paste has defined percentages of metal content and physical form of metal, and a prescribed single point viscosity range. The circuit board can be clamped to a datum position while being filled. Monitoring of the deposited solder paste can be obtained by depositing the solder paste on a substrate, for example of ceramic, and the paste fused to form balls. The size and position of the balls can then be visually monitored by a scanning apparatus in conjunction with a computer. - i -

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