H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/14 (2006.01) H01L 23/64 (2006.01) H05K 3/30 (2006.01) H05K 1/16 (2006.01)
Patent
CA 2057744
A multichip module for interconnecting a plurality of integrated circuits. A thick layer of silicon dioxide, up to 20 µm, serves as a dielectric to separate metal signal layers from power and ground planes. The multichip module also has a capacitor formed over a support base material which need not be conductive. A metal interconnect structure for a multichip module used for interconnecting a plurality of integrated circuits. The module interconnects can be provided with termination resistors and can also be formed to have a multiple padout structure. Reverse wedge wire bonding is also used to electrically connect the integrated circuit to the module allowing greater chip densities on the module surface. The chip/module assembly can then be mounted on a printed circuit board and the module leads wired directly to the board.
Benson Donald
Bobra Yogendra
Brathwaite Nicholas E.
Lang Charles R.
Mcwilliams Bruce M.
Fetherstonhaugh & Co.
Flextronics International (usa) Inc.
Nchip Inc.
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