Multichip module

Details Multichip module Multichip module

H - Electricity

01

L

H01L 23/525 (2006.01) H01L 21/60 (2006.01) H01L 23/538 (2006.01)

Patent

CA 2056781

Multichip module is provided with standard wiring layers comprising standardized wiring patterns, a custom wiring layers comprising customized wiring patterns and chip mounting pads, a plurality of antifuses which are positioned in standardized installation positions and each of which provides the possibility of defining the presence or absence of an electrical connection between a specified conductive track of a standard wiring layer and a specified conductive track of the custom wiring layer, and a plurality of wafer chips which are electrically connected to the chip mounting pads and mounted on the chip mounting pads, whereby disadvantages of hybrid integrated circuits are overcome while offering numerous advantages of hybrid integrated circuits.

Affiliated with

Also associated with

Rating

Multichip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multichip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2006800