Multichip module substrate structure

Details Multichip module substrate structure Multichip module substrate structure

H - Electricity

01

L

H01L 23/485 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01) H01L 23/538 (2006.01)

Patent

CA 2126822

ABSTRACT Multichip Module Substrate Structure A multichip module structure incorporating a multilayer metallisation polymer dielectric deposition on a substrate wherein below the uppermost metallisation layer there is deposited a silicon nitride layer. Preferably a silicon nitride layer is also deposited above the uppermost metallisation layer. (Fig.1)

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