Multilayer bus bars and assembly techniques

Details Multilayer bus bars and assembly techniques Multilayer bus bars and assembly techniques

H - Electricity

02

G

337/30

H02G 5/00 (2006.01) H05K 1/02 (2006.01) H05K 1/16 (2006.01)

Patent

CA 1181500

ABSTRACT OF THE DISCLOSURE A method of construction of miniature bus bar assemblies which incorporate discrete capaci- tive elements having a high dielectric constant are presented herein. The capacitive elements are preferably metallized ceramic wafers which are bonded between a pair of bus bar conductors. In one embodiment, bonding is by strips of solder. In other embodiments, printed circuit elements are employed, both for electrical connection between the capacitor elements and the bus bars, and to define the bus bars.

398712

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