Multilayer ceramic wiring substrate and pin connecting...

Details Multilayer ceramic wiring substrate and pin connecting... Multilayer ceramic wiring substrate and pin connecting...

H - Electricity

05

K

356/5

H05K 1/03 (2006.01) H01L 23/498 (2006.01) H05K 1/11 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2036771

Abstract of the Disclosure A multilayer ceramic wiring substrate includes a polyimide resin layer, first lands, and pins for external connection. The polyimide resin layer is formed on a ceramic substrate and has via holes arranged at positions where the polyimide resin layer is connected to through holes filled with a conductive material. The first lands are formed on the upper surface of the polyimide resin layer to cover the via holes. The pins are respectively brazed to the first lands by a brazing material.

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