H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/15, 356/16
H05K 1/11 (2006.01) H05K 1/00 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01)
Patent
CA 1055164
ABSTRACT OF THE DISCLOSURE A multilayer printed circuit board structure and a method for generating artwork masters for the manufacture thereof. The multilayer board comprises universal internal layers of prede- fined circuit patterns. The internal layers include power and ground planes, and for boards having high component and circuit density, one or two signal crossover layers with short, equal- length runs oriented transversely to the runs of an adjacent out- ermost signal layer. Electrical interconnections between layers of the circuit board are effected by interlayer conductors such as pins or plated-through holes at predefined locations. The artwork masters for the outermost layers are generated utilizing two degrees of layout precision. A universal layout master hav- ing interconnection pads and parallel circuit runs extending across the entire surface of the board is first prepared using a high degree of precision. The universal layout master is then superposed with other layout masters including a component matrix and utilized to generate a composite artwork master having rela- tively short circuit runs of a second degree of precision inter- connecting the parallel runs and the pads. A tool for a unique outermost layer is then reproduced from the composite artwork master utilizing an artwork master of another layer to control interlayer registration.
255356
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