C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
356/16
C23F 1/02 (2006.01) B44C 1/22 (2006.01) C03C 15/00 (2006.01)
Patent
CA 1253630
14 Abstract A circuit board is manufactured from a core layer having a conductor run layer overlying the core layer on one side thereof, and a continuous layer of dielectric material overlying the conduc- tor run layer, by forming a continuous outer layer of conductive material over the layer of dielectric material. Material of the continuous outer layer is removed at a predetermined location, and the dielectric material that is thus exposed is also removed so as to form an opening through which the conductor run layer is exposed. Conductive mate- rial is deposited into the opening to at least the level of the outer conductor layer, whereby the conductor run layer is connected to the outer layer of conductive material.
523229
Interconnect Technology Inc.
Kirby Eades Gale Baker
LandOfFree
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