Multilayer circuit board having microporous layers and...

Details Multilayer circuit board having microporous layers and... Multilayer circuit board having microporous layers and...

H - Electricity

05

K

356/16

H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2028710

Abstract of the Disclosure A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

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